|
Title |
Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation and Model Calibration |
| Journal |
IEEE Transactions on Components, Packaging, and Manufacturing Technology |
| Authors |
H. Oh*, H. -P. Wei, B. Han*, and B. D. Youn |
| Date |
2016.02. |
| Citation Index |
SCIE, SCOPUS, EI (IF: 1.151, Rank: 54.28%) |
| Vol. / Page |
Vol. 6, pp. 238-248 |
| File |
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| Link |
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| Visits |
919 |
