10 |
|
IEEE Transactions on Components, Packaging, and Manufacturing Technology |
Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation and Model Calibration
|
H. Oh*, H. -P. Wei, B. Han*, and B. D. Youn |
2016.02. |
SCIE, SCOPUS, EI (IF: 1.151, Rank: 54.28%) |
9 |
|
Structural and Multidisciplinary Optimization |
Hierarchical Model Calibration for Designing Piezoelectric Energy Harvester in the Presence of Variability in Material Properties and Geometry
|
B. C. Jung, H. Yoon, H. Oh, G. Lee, M. Yoo, B. D. Youn*, and Y. -C. Huh |
2016.01. |
SCIE, SCOPUS, EI (IF: 2.208, Rank: 14.71%) |
8 |
|
Reliability Engineering & System Safety |
An Empirical Model to Describe Performance Degradation for Warranty Abuse Detection in Portable Electronics
|
H. Oh, S. Choi, K. Kim, B. D. Youn*, and M. Pecht |
2015.10. |
SCIE, SCOPUS, EI (IF: 2.410, Rank: 9.14%) |
7 |
|
IEEE Transactions on Power Electronics |
Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
|
H. Oh, B. Han*, P. McCluskey, C. Han, and B. D. Youn |
2015.05. |
SCIE, SCOPUS, EI (IF: 6.008, Rank: 1.01%) |
6 |
|
Structural and Multidisciplinary Optimization |
A Framework of Model Validation and Virtual Product Qualification with Limited Experimental Data Based on Statistical Inference
|
B. C. Jung, J. Park, H. Oh, J. Kim, B. D. Youn* |
2015.03. |
SCIE, SCOPUS, EI (IF: 1.974, Rank: 17.06%) |
5 |
|
Tribology International |
Failure Mechanisms of Ball Bearings under Lightly Loaded, Non-Accelerated Usage Conditions
|
H. Oh*, M. H. Azarian, C. Morillo, E. Rhem, and M. Pecht |
2015.01. |
SCIE, SCOPUS, EI (IF: 1.936, Rank: 16.54%) |
4 |
|
International Journal of Prognostics and Health Management |
Risk Prediction of Engineering Assets: An Ensemble of Part Lifespan Calculation and Usage Classification Methods
|
H. Kim, T. Hwang, J. Park, H. Oh*, and B. D. Youn |
2014.11. |
Invited Paper; Winner of PHM Data Challenge Competition |
3 |
|
IEEE Transactions on Device and Materials Reliability |
A Critique of the IPC-9591 Standard: Performance Parameters for Air Moving Devices
|
H. Oh*, M. H. Azarian, D. Das, and M. Pecht |
2013.03. |
SCIE, SCOPUS, EI (IF: 1.890, Rank: 27.71%) |
2 |
|
Journal of Intelligent Manufacturing |
Precursor Monitoring Approach for Reliability Assessment of Cooling Fans
|
H. Oh, T. Shibutani*, and M. Pecht |
2012.04 |
SCIE, SCOPUS, EI (IF: 1.731, Rank: 25%) |
1 |
|
Science and Technology of Welding and Joining |
Simulation of Capacitor Discharge Stud Welding Process and Void Formation
|
H. Oh, J. Lee*, and C. D. Yoo |
2007.04. |
SCIE, SCOPUS, EI (IF: 1.707, Rank: 18.91%) |