Gwangju Institute of Science and Technology

Smart Diagnosis and Design Optimization Laboratory

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International Journal

No. Paper Journal Title Authors Date Citation
Index
10
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IEEE Transactions on Components, Packaging, and Manufacturing Technology Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation and Model Calibration H. Oh*, H. -P. Wei, B. Han*, and B. D. Youn 2016.02. SCIE, SCOPUS, EI (IF: 1.151, Rank: 54.28%)
9
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Structural and Multidisciplinary Optimization Hierarchical Model Calibration for Designing Piezoelectric Energy Harvester in the Presence of Variability in Material Properties and Geometry B. C. Jung, H. Yoon, H. Oh, G. Lee, M. Yoo, B. D. Youn*, and Y. -C. Huh 2016.01. SCIE, SCOPUS, EI (IF: 2.208, Rank: 14.71%)
8
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Reliability Engineering & System Safety An Empirical Model to Describe Performance Degradation for Warranty Abuse Detection in Portable Electronics H. Oh, S. Choi, K. Kim, B. D. Youn*, and M. Pecht 2015.10. SCIE, SCOPUS, EI (IF: 2.410, Rank: 9.14%)
7
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IEEE Transactions on Power Electronics Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review H. Oh, B. Han*, P. McCluskey, C. Han, and B. D. Youn 2015.05. SCIE, SCOPUS, EI (IF: 6.008, Rank: 1.01%)
6
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Structural and Multidisciplinary Optimization A Framework of Model Validation and Virtual Product Qualification with Limited Experimental Data Based on Statistical Inference B. C. Jung, J. Park, H. Oh, J. Kim, B. D. Youn* 2015.03. SCIE, SCOPUS, EI (IF: 1.974, Rank: 17.06%)
5
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Tribology International Failure Mechanisms of Ball Bearings under Lightly Loaded, Non-Accelerated Usage Conditions H. Oh*, M. H. Azarian, C. Morillo, E. Rhem, and M. Pecht 2015.01. SCIE, SCOPUS, EI (IF: 1.936, Rank: 16.54%)
4
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International Journal of Prognostics and Health Management Risk Prediction of Engineering Assets: An Ensemble of Part Lifespan Calculation and Usage Classification Methods H. Kim, T. Hwang, J. Park, H. Oh*, and B. D. Youn 2014.11. Invited Paper; Winner of PHM Data Challenge Competition
3
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IEEE Transactions on Device and Materials Reliability A Critique of the IPC-9591 Standard: Performance Parameters for Air Moving Devices H. Oh*, M. H. Azarian, D. Das, and M. Pecht 2013.03. SCIE, SCOPUS, EI (IF: 1.890, Rank: 27.71%)
2
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Journal of Intelligent Manufacturing Precursor Monitoring Approach for Reliability Assessment of Cooling Fans H. Oh, T. Shibutani*, and M. Pecht 2012.04 SCIE, SCOPUS, EI (IF: 1.731, Rank: 25%)
1
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Science and Technology of Welding and Joining Simulation of Capacitor Discharge Stud Welding Process and Void Formation H. Oh, J. Lee*, and C. D. Yoo 2007.04. SCIE, SCOPUS, EI (IF: 1.707, Rank: 18.91%)
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